【陶瓷芯片球栅阵列CBGA焊点弹塑性-蠕变计算分析及可靠度评估】.pdf
浙江大学硕士学位论文 附录 AThesisSubmittedtoZhejiangUniversity fortheDegreeofMasterofScience ElasticPlastic-CreepComputationalAnalysis ReliabilityEvaluationofBallGridArraySolder JointinCemaricQuartzChip(CBGA) Candidate:ZhaoYong Speciality:StructralEngineering Supervisor:AssociateProf.
浙江大学硕士学位论文 附录 s2.进一步研究的展望 参考文献 致谢
浙江大学硕士学位论文 附录 ABSTRACT BallGridArraySolderJointinCemaricQuartzChip(CBGA) Surface MountTechnology(SMT)nowis akind ofcontinually developing polytechnic prevalent in electronic industry.In this dissertation,elastic-plastic creep analysisreliability evaluationis carriedout tostudy cemaricball grid arra