[陶瓷和陶瓷金属部分瞬间液相连接的界面反应模型和接头强度研究]

【陶瓷陶瓷和陶瓷金属部分瞬间液相连接的界面反应模型和接头强度研究】.pdfStudy on the Interfacial Reaction,ModelandJoint Strength inPartialTransient Liquid-PhaseBonding ofCeramicsandMetals Author:ChenZheng Advisor:Prof.Zhizhang Li Prof.Hongqinglou Departmentof MaterialsScience and Engineering Zhejiang University,P.R.Ph.D.Dissertation,Zhejiang University ABSTRACT The dynamics of reaction in the PTLP bonding of SiN ceramic with Ti/Ni/Ti multi-interlayers has been systematically studied.The growth of both the TiN layer and tbe mixed reactionlayer obeys the parabolic law and is governed by the diffusion of detePh.D.Dissertation,Zhejiang University ABSTRACT The joint obtained by this new method has substantially higher strength than that obtained by conventional PTLP bonding without a Cu foil, due to the elimination of brittle Ni-Ti compound layer and the decrement of residual stress.
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